Die Separator

能对薄型芯片的叠层所需的DAF(Die Attach Film)或者激光隐行切割后的加工物进行高品质分割的装置。

			DDS2010	DDS2300	DDS2310
最大加工物尺寸		mm	ø200	ø300
诸要素	尺寸(WxDxH)	mm	718 x 897 x 1,608	1,200 x 1,550 x 1,800	1,200 x 1,800 x 1,955
	重量	kg	约450	约900	约1,000

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